![]() Large area filters offer long life and on-the-fly replacement. Cureflow™ Ovens are available with either a mesh belt or Edge Grabber™ conveyor. It can be used for effectively soldering various SMD and BGA components. Access to the process cavity is available from either side of the assembly line via the patented hood lift while also allowing the same system to serve in either a Right to Left or Left to Right process direction. Compact size High reliability Product Description: The INFRARED IC HEATER T962 is a micro processor controlled reflow-oven. Cross-platform (Windows, Machintosh, Linux) Software provides an easy to learn and easy to use interface to control the solder reflow oven. The 1.75 inch throat opening (above and below the Edge Grabber ™ conveyor pass-line) accepts tall electronic assemblies. Air is cascaded from one zone to the next reducing energy consumption. Commercial conveyorised reflow ovens include numerous separately heated. In commercial high-volume application, reflow ovens have the shape of a lengthy tunnel with a conveyor belt that transports PCBs. Columnized air retains its direction and velocity resulting in maximum impingement velocity on the product, high energy transfer and Near Equilibrium Heating™. A reflow oven is a machine that is mainly used for the reflow soldering of surface-mount electronic components to printed circuit boards (PCBs). The air is heated and forced through nozzles onto the product. Recycled and Cascaded air is drawn from the low thermal mass process cavity with tangential blower wheels running the full width of the process cavity for even airflow. Low mass coil heating elements provide quick response for varying production loads ensuring process repeatability. Infra-red “boosters” provide quick temperature acceleration to high thermal mass components or ground planes while Recirculating Hot Air (RHA) blowers maintain even temperature to all areas of the assembly. Utilizing existing technologies from other ETS Factory Automation, Material Handling Conveyors and Thermal Ovens, Cureflow™ optimizes thermal energy transfer to electronic assemblies through its unique combination of Convection and Infra-red heat delivery systems. The solder paste melts and flows, wicking away. SMT Reflow Ovens for Solder Reflow and Adhesive Curing: Cureflow™ is a flexible family of products designed for Lead or Lead Free Solder Reflow, adhesive curing and other Surface Mount Technology (SMT) heating and thermal processing requirements. The reflow phase takes the PCB from thermal equilibrium to temperatures above the solders melting point. Solder Reflow and Adhesive Curing Oven Cureflow ™
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